131: Electrical Board

Steady state heat transfer analysis of 5 different electrical boards. Each assembly (such as the processor board) was subjected to the temperatures due to the operating condition of the board. For each assembly, the maximum temperature observed was reported.

stress analysis model of engineering component

131: Electrical Board

Steady state heat transfer analysis of 5 different electrical boards. Each assembly (such as the processor board) was subjected to the temperatures due to the operating condition of the board. For each assembly, the maximum temperature observed was reported.